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Flex Printed Circuits Board (FPC)
Integrated Circuits Substrates (ICS)
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Subtractive Etching Process (SEP)
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Product Range
Single Side Flex
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Telecommunication
Medical
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ICS Package
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TELECOMMUNICATION
Function: to mechanically support and electrically connect SMT components or/and semiconductor dies (System in Package SiP)
PCB category: Rigid PCB, Flexible PCB, Lead Frame, Tenting Substrate, SAP Substrate etc.
Process technology: photo-imaging, copper plating, developing, etching, surface treatment, lamination, laser/mechanical drilling, solder masking, electrical test, auto inspection etc.
4-LAYER RIGID FLEX TELECOMM
4 Layers PCB with OSP for SMT Assembly
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