Facilities – QDOS

DESIGN, RESEARCH & DEVELOPMENT

As experts in FPC, we assist you in making informed decisions on FPC design, manufacturing and assembly. Transferring circuit schematic into routing design can be a challenging process. With a dedicated team of design engineers, we are able to deliver innovative design solutions.

Cadence design system.
CAD/CAM-empowered DFM platform.
Proven track record of New Product Introduction (NPI).
R&D collaboration with University Sains Malaysia (USM) and University of Southampton.
Graduate engineers from USM, Imperial College London and University of Cambridge.
In-house artwork plotter for non-disclosure protection.
CAD/CAM design platform guarantees accuracy and speed up New Product Introduction (NPI).

MANUFACTURING

Automatic or semi-automatic circuits formation/circuits protection/circuits finishing facilities.

VCP – Vertical Continuous Plating for CU plating.
Plasma cleaning for rigid-flex and multi-layered flex.
UV laser-cutting for quick turn samples.
LDI – Laser direct imaging for fine pitch flex & HMLV.
AOI – Automatic optical inspection for circuits formation.
Automatic outline punching.
Jet scrubbing for improving surface.
finishing.

QUALITY & RELIABILITY

Cadence design system.
CAD/CAM-empowered DFM platform.
Proven track record of New Product Introduction (NPI).
R&D collaboration with University Sains Malaysia (USM) and University of Southampton.
Graduate engineers from USM, Imperial College London and University of Cambridge.
Automatic PI & stiffeners bonding machine.
Automatic adhesive dispenser for IC protection.
Automatic IC programming and module functional test.
SMT for FPC assembly.

DESIGN, RESEARCH & DEVELOPMENT

MANUFACTURING

QUALITY & RELIABILITY

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PRODUCTS & APPLICATIONS

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