Automatic or semi-automatic circuits formation/circuits protection/circuits finishing facilities.

• VCP – Vertical Continuous Plating for CU plating.
• Plasma cleaning for rigid-flex and multi-layered flex.
• UV laser-cutting for quick turn samples.
• LDI – Laser direct imaging for fine pitch flex & HMLV.
• AOI – Automatic optical inspection for circuits formation.
• Automatic outline punching.
• Jet scrubbing for improving surface
• finishing.