We provide a wide range of FPC’s, including single-sided, double-sided, multi-layer, rigid flex, thin-core PCB and assembly (FPCA). We also make a variety of surface finishing and materials available to satisfy your product requirement. If you are not familiar with FCB manufacturing, our design engineers will be able to assess your design to ensure optimum performance and value.
We specialize in fine-line IC substrates using Semi-Additive Process (SAP) and build-up film. We design and manufacture a portfolio of high-end IC substrates, consisting of Coreless ABF Substrate (up to 4 layers), Hitachi-core ABF Substrate (4-8 layers), Sputtered-core Substrate.
Leveraging on our licensed Molded Interconnect Substrate (MIS) technology with latest process innovations, we serve a wide range of package applications including flip chip, wire bonding, tape, SiP on the first-level interconnect, and QFN, TAB, LGA, BGA etc. on the second/SMT-level interconnect. In short, we package portfolio includes FCBGA, FCCSP, TAB, WBLGA, FCLGA etc.